Journal Papers

  1. Liu, Song, Pengcheng Sun, Mingyue Wang, Yujie Jiang, Jiaqi Li, Yuyu Jia, Zhenhuan Sun, Hai Liu, Haojian Lu, and Zuankai Wang. “Acousto-dewetting enables droplet microfluidics on superhydrophilic surfaces.” Nature Physics (2025): 1-9.
  2. Liu, Hai, M. Barekatain, A. Roy, S. Liu, Y. Cao, Y. Tang, A. Shkel and E.S. Kim, “MEMS Piezoelectric Resonant Microphone Array for Lung Sound Classification,” Journal of Micromechanics and Microengineering, 33, No. 4 (2023), 044003.
  3. Fan, Shuyu, Yongkui Tang, Lurui Zhao, Hai Liu, Yufeng Wang, Dibo Hou, and Yunqi Cao. “Design optimization of microfabricated coils for volume-limited miniaturized broadband electromagnetic vibration energy harvester.” Energy Conversion and Management 271 (2022): 116299.
  4. Barekatain, Matin, Hai Liu, and Eun Sok Kim. “Wireless and Battery-Less Tamper Detection With Pyroelectric Energy Converter and High-Overtone Bulk Acoustic Resonator.” IEEE Sensors Journal 22, no. 14 (2022): 14639-14646.
  5. Liu, Hai, Song Liu, Anton A. Shkel, and Eun Sok Kim. “Active noise cancellation with MEMS resonant microphone array.” Journal of Microelectromechanical Systems 29, no. 5 (2020): 839-845.

Conference Papers

  1. Li, Jiaqi, Zhenhuan Sun, Hai Liu, and Song Liu. “MEMS Amplitude-Gradient Acoustic Transducer (AGAT) for Controllable Particle Transportation.” In 2025 IEEE International Ultrasonics Symposium (IUS), pp. 1-4. IEEE, 2025.
  2. Li, Jiaqi, Zhenhuan Sun, Hai Liu, and Song Liu. “Obstacle-crossing Self Focused Acoustic Transducer based on Bessel Beams.” In 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), pp. 1-4. IEEE, 2024.
  3. Sengupta, Anik, Akash Roy, Hongxiang Gao, Matin Barekatain, Hai Liu, and Eun Sok Kim. “Wearable Stethoscope Based on Resonant Microphone Array with Wireless Data Transfer.” In 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), pp. 101-104.
  4. Li, Jiaqi, Zhenhuan Sun, Yuyu Jia, Tang Li, Haojian Lu, Lurui Zhao, Hai Liu, and Song Liu. “MEMS First-Order Bessel Beam Acoustic Transducer for Particle Trapping And Controllable Rotating.” In 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), pp. 965-968. IEEE, 2023.
  5. Li, Jiaqi, Zhenhuan Sun, Hai Liu, Lurui Zhao, Teng Li, and Song Liu, “Bottle trap acoustic transducer with PDMS Lens for Particle Trapping”, In 2023 IEEE International Ultrasonics Symposium (IUS), IEEE, 2023.
  6. Sun, Zhenhuan, Jiaqi Li, Hai Liu, Lurui Zhao, Teng Li, and Song Liu. “Rotation-free high order Bessel beam acoustic transducer for particle trapping.” In 2023 IEEE International Ultrasonics Symposium (IUS), IEEE, 2023.
  7. Li, Jiaqi, Zhenhuan Sun, Hai Liu, Lurui Zhao, Teng Li, and Song Liu. “Twin Trap Acoustic Transducer with PDMS Fresnel Lens for Particle Trapping.” In 2023 IEEE International Ultrasonics Symposium (IUS), IEEE, 2023.
  8. Sun, Zhenhuan, Jiaqi Li, Hai Liu, Lurui Zhao, Teng Li, and Song Liu. “Ultrasonic Transducer encoding intersecting Bessel beams for particle patterning.” In 2023 IEEE International Ultrasonics Symposium (IUS), IEEE, 2023.
  9. Jia, Yuyu, Zhenhuan Sun, Jiaqi Li, Lurui Zhao, Hai Liu, Teng Li, and Song Liu. “MEMS Bessel Beam Acoustic Transducer (MEMS-BBAT) with Air-Cavity Lens Based on Spiral Diffraction Grating for Particle Trapping.” In 2022 IEEE International Ultrasonics Symposium (IUS), 2022.
  10. Sun, Zhenhuan, Jiaqi Li, Yuyu Jia, Yuhang Liu, Kunyong Lyu, Hai Liu, Hu Su, Teng Li, and Song Liu. “Particle Trapping and Transportation with MEMS Zeroth-order Bessel Beam Acoustic Transducer (BBAT).” In 2022 IEEE International Conference on Robotics and Biomimetics (ROBIO), pp. 1-6. IEEE, 2022.
  11. Liu, Hai, A. Roy, Y. Tang, M. Barekatain and E.S. Kim, “Ultrasonic Air-Borne Propulsion Through Synthetic Jets,” Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, June 5 - 9, 2022, pp. 226 - 229.
  12. Liu, Hai, Song Liu, Anton A. Shkel, Yongkui Tang, and Eun Sok Kim. “Multi-band MEMS resonant microphone array for continuous lung-Sound monitoring and classification.” In 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), pp. 857-860. IEEE, 2020. Outstanding Student Paper Award Finalist (18/275).
  13. Liu, Hai, Song Liu, Anton A. Shkel, Yongkui Tang, and Eun Sok Kim. “MEMS resonant microphone array for lung sound classification.” In 2019 IEEE International Electron Devices Meeting (IEDM), pp. 34-4. IEEE, 2019.
  14. Liu, Hai, Li Jin, Liqun Gu, Juanjuan Li, Ying Li, Qiang Chen, Maouha Du, Jianwei Zhou, and TaeSub Chang. “Solder joint reliability with various silver finish on PCB.” In 2014 15th International Conference on Electronic Packaging Technology, pp. 396-400. IEEE, 2014.
  15. Liu, Hai, Zhenqing Zhao, Qiang Chen, Jianwei Zhou, Maohua Du, Senyun Kim, Jonghyun Chae, and Myungkee Chung. “Reliability of copper wire bonding in humidity environment.” In 2011 IEEE 13th Electronics Packaging Technology Conference, pp. 53-58. IEEE, 2011.
  16. Chen, Qiang, Zhenqing Zhao, Hai Liu, Jonghyun Chae, Senyun Kim, and Myungkee Chung. “Investigation of various pad structure influence for copper wire bondability.” In 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, pp. 1-4. IEEE, 2011.
  17. Liu, Hai, Qi Chen, Zhenqing Zhao, Qian Wang, Jianfeng Zeng, and Jonghyun Chae. “Reliability of Au-Ag alloy wire bonding.” In 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), pp. 234-239. IEEE, 2010.
  18. Zhang, Jing, Hai Liu, and Jaisung Lee. “Board level cyclic bending test for MCP package.” In 2007 9th Electronics Packaging Technology Conference, pp. 459-462. IEEE, 2007.
  19. Liu, Hai, Jing Zhang, Song Chen, Maohua Du, Nufeng Feng, Qian Wang, and Taekoo Lee. “Board level thermal cycle reliability of BGA for a new type of pad structure with OSP surface finish.” In 2007 8th International Conference on Electronic Packaging Technology, pp. 1-3. IEEE, 2007.

Patents

  1. Liu, Hai. “Methods of manufacturing printed circuit board and semiconductor package.” U.S. Patent 10,049,970 B2, issued August 14, 2018.
  2. Liu, Hai. “Printed circuit board for semiconductor package.” U.S. Patent 9,504,152 B2, issued November 22, 2016.
  3. Liu, Hai. Surface Coating and Semiconductor Packaging Including the Surface Coating, Chinese patent 106954335 B, issued September 17, 2019.
  4. Liu, Hai. Printed Circuit Board and Semiconductor Packaging Including It, Chinese patent 105307386 B, issued July 06, 2018.
  5. Liu, Hai. A Mixed Surface Coating and Its Manufacturing Method, Chinese patent 103227160 B, issued March 16, 2016
  6. Lu, Kai, Hai Liu. Mixed Solder Ball Arrangement and Its Formation Method, Chinese patent 103219310 B, issued July 13, 2016.